Thermal management of computer hardware modules

An optical transceiver, comprising:

• at least one optical module packaged within a housing, wherein:
• the housing comprising a generally rectangular top surface defining a pattern adapted to enhance capillary action of a thermal interface material (TIM) applied thereon;
• and
• a groove in the top surface, wherein the groove is adapted to receive a seal when the housing is inserted into a socket.

A method of cooling a pluggable hardware module, comprising:

• providing a socket assembly, wherein the socket assembly comprises an integrated fluid reservoir containing a thermal interface material (TIM);
• providing a hardware module, wherein the hardware module and the socket assembly are adapted to define a gap when the hardware module is plugged into the socket assembly;
• providing at least one dispensing port in fluid communication with the integrated fluid reservoir and the gap;
• and
• plugging the hardware module into the socket, wherein the at least one dispensing port is adapted to automatically distribute TIM from the integrated fluid reservoir into the gap when the hardware module is plugged into the socket assembly.