Light deflection structure to increase optical coupling
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Wei Tseng, Jui Lin Chao, Hsing-Kuo Hsia, Yutong Wu, Chen-Hua Yu
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Abstract
Various embodiments of the present disclosure are directed towards a semiconductor device including a dielectric structure disposed on a first substrate. An edge coupler is disposed within the dielectric structure and comprises a plurality of optical core segments. A deflector structure is disposed within the dielectric structure and is laterally adjacent to the edge coupler. The deflector structure is configured to redirect an optical signal traveling along a first direction to a second direction towards the edge coupler.
Claims20
A semiconductor device, comprising:
- a dielectric structure disposed on a first substrate;
- an edge coupler disposed within the dielectric structure, wherein the edge coupler comprises a plurality of optical core segments;
- and
- a deflector structure disposed within the dielectric structure and laterally adjacent to the edge coupler, wherein the deflector structure is configured to redirect an optical signal traveling along a first direction to a second direction towards the edge coupler.
A semiconductor package, comprising:
- a lower substrate;
- a first integrated circuit (IC) chip and a second IC chip overlying the lower substrate and laterally adjacent to one another;
- and
- a photonic chip overlying the lower substrate, wherein the photonic chip is adjacent to the second IC chip, wherein the first IC chip, the second IC chip, and the photonic chip are electrically coupled to one another by one or more metallization layers, wherein the photonic chip comprises an edge coupler disposed in an inner device region and a deflector structure disposed in a peripheral region adjacent to the inner device region, wherein a surface of the deflector structure faces the edge coupler.
A method for forming a semiconductor structure, comprising:
- forming a plurality of photonic devices in a first substrate, wherein the photonic devices are disposed within an inner device region;
- forming an insulator structure around the photonic devices;
- forming a lower dielectric structure on a back-side surface of the first substrate;
- forming an edge coupler in the lower dielectric structure and within the inner device region;
- and
- forming a deflector structure within the lower dielectric structure, wherein the deflector structure is disposed within a peripheral region laterally adjacent to the edge coupler.
Dependencies are inferred from the claim text.