Devices and methods for noise testing of a substrate including through silicon vias
AssigneeShanghai United Imaging Microelectronics Technology Co., Ltd.
InventorChangzhi SHI
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Abstract
Embodiments of the present disclosure provide a device and a method for noise testing of a substrate including through silicon vias (TSVs). The device may include a substrate including first TSVs; an excitation link including at least two groups of second TSVs; an insulation layer arranged between the excitation link and the substrate; and a testing link including at least one group of third TSVs, the testing link being electrically connected with the substrate.
Claims20
A device, comprising:
- a substrate including first through silicon vias (TSVs);
- an excitation link including at least two groups of second TSVs;
- an insulation layer arranged between the excitation link and the substrate;
- and
- a testing link including at least one group of third TSVs, the testing link being electrically connected with the substrate.
A method implemented on a device including a substrate including first through silicon vias (TSVs);
- an excitation link including at least two groups of second TSVs;
- an insulation layer arranged between the excitation link and the substrate;
- and a testing link including at least one group of third TSVs, the testing link being electrically connected with the substrate, the method comprising:
- applying a pulse signal to the excitation link;
- obtaining one or more response signals in the testing link;
- and
- determining, based on the one or more response signals, a noise level and a distribution of a noise of the substrate.
A system, comprising:
- at least one storage device storing a set of instructions;
- and
- at least one processor in communication with the at least one storage device, when executing the stored set of instructions, the at least one processor causes the system to perform a method implemented on a device including a substrate including first through silicon vias (TSVs);
- an excitation link including at least two groups of second TSVs;
- an insulation layer arranged between the excitation link and the substrate;
- and a testing link including at least one group of third TSVs, the testing link being electrically connected with the substrate, the method comprising:
- applying a pulse signal to the excitation link;
- obtaining one or more response signals in the testing link;
- and
- determining, based on the one or more response signals, a noise level and a distribution of a noise of the substrate.
Dependencies are inferred from the claim text.