Integrated circuit test socket with integrated device picking mechanism
AssigneeWestern Digital Technologies, Inc.
InventorsYalaj Goyal, Shailesh R. Nayak, Joe Paul Moolanmoozha
Life of this patent
Estimating the term…
Abstract
An integrated circuit (IC) device test socket has an integrally formed IC picking mechanism for removing an IC device from the test socket after testing. The test socket has a base member and a cover member. The base member includes a recess that is configured to receive an IC device for testing. The cover member is configured to removably engage the base member to secure the IC device between the cover member and the base member. The cover member includes an IC picking mechanism configured to use suction to retain the IC device to the cover member.
Claims22
An integrated circuit test socket comprising:
- a base member comprising a recess configured to receive an integrated circuit (IC) device for testing;
- and
- a cover member configured to removably engage the base member to secure the IC device between the cover member and the base member, the cover member comprising an IC picking mechanism integrally formed in the cover member, configured to:
- apply, in a first position, a suction to retain the IC device to the cover member, and
- release, in a second position, the IC device from the cover member.
An integrated circuit test socket comprising:
- a base member for holding an integrated circuit (IC) device to be tested therein;
- and
- a cover member configured to removably engage the base member to secure the IC device between the cover member and the base member, the cover member comprising:
- a through-aperture formed between a first surface of the cover member and a second surface of the cover member;
- and
- a plunger movable in the through-aperture to change an atmospheric pressure inside the through-aperture to control a suction that retains the IC device to the cover member.
A method of handling an integrated circuit (IC) device under test, comprising:
- positioning an IC device in a test socket comprising a base member and a cover member configured to removably engage the base member to secure the IC device between the cover member and the base member during testing;
- operating an IC picking mechanism integrally formed in the cover member to generate a suction that holds the IC device to the cover member;
- and
- removing the IC device from the base member by separating the cover member from the base member with the IC device attached to the cover member by the suction.
A method of handling an integrated circuit (IC) device under test, comprising:
- positioning an IC device in a test socket comprising a base member and a cover member configured to removably engage the base member to secure the IC device between the cover member and the base member during testing;
- separating the cover member from the base member with the IC device;
- and
- operating an IC picking mechanism integrally formed in the cover member to dislodge the IC device from the cover member.
Dependencies are inferred from the claim text.