Sensor-chip and manufacturing method thereof
AssigneesThe General Hospital Corporation, Korea Advanced Institute of Science and Technology
InventorsHakho Lee, Hyungsoon Im, Nam Ho Bae, Seok Jae Lee, Kyoung Gyun Lee, Kwang Hee Kim, Kil Sun Roh
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Abstract
Methods, systems, and apparatus, for a sensor-chip device for performing analysis on target substances. In one aspect, the sensor-chip assembly includes a chip body including a substrate, at least one metal layer formed on the substrate, and nanoholes formed in the metal layer, a base having an accommodating portion for accommodating the chip body, and a fixing member fixing the chip body accommodated in the accommodating portion by being coupled to the base.
Claims21
A sensor-chip assembly for detecting a target substance using surface plasmon resonance, the sensor-chip assembly comprising:
- a chip body comprising a substrate, at least one metal layer formed on the substrate, and a plurality of nanoholes formed in the metal layer;
- a base having an accommodating portion for accommodating the chip body;
- and
- a fixing member fixing the chip body accommodated in the accommodating portion by being coupled to the base, wherein a volume is defined in part by a first surface of the chip body and a second surface of the fixing member.
A sensor-chip assembly for detecting a target substance using surface plasmon resonance, the sensor-chip assembly comprising:
- a chip body comprising a substrate, at least one metal layer formed on the substrate, and a plurality of nanoholes formed in the metal layer;
- a housing having an accommodating portion for accommodating the chip body;
- and
- a fixing member fixing the chip body accommodated in the accommodating portion by being coupled to the housing, wherein a volume is defined in part by a first surface of the chip body and a second surface of the housing.
A method of manufacturing a sensor-chip assembly for detecting a target substance using surface plasmon resonance, the method comprising:
- preparing a chip body, the preparation comprising:
- preparing a substrate including a glass or quartz material;
- forming a metal layer on a side of the substrate;
- forming a photoresist pattern on the metal layer through a photolithography process;
- and
- forming nanoholes on the metal layer by etching and removing photoresist remaining on the metal layer;
- preparing a base having an accommodating portion;
- disposing the chip body to be accommodated in the accommodating portion;
- and
- fixing the chip body accommodated in the accommodating portion to the base using a fixing member.
Dependencies are inferred from the claim text.