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US 2023/0416920 A1Published application
Substrate processing apparatus and substrate processing method
AssigneeTokyo Electron Limited
InventorsTatsuya YAMAGUCHI, Yutaka SASAKI, Makoto TAKAHASHI, Toru ISHII, Naoshige FUSHIMI, Koji YOSHII
Life of this patent
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Abstract
A substrate processing apparatus includes: a processing container that accommodates a substrate; a processing gas supply that supplies a processing gas into the processing container; an exhaust that exhausts an inside of the processing container; a heater that heats the processing container; and a cooling gas injector that injects a cooling gas for cooling the substrate.
Claims14
A substrate processing apparatus comprising:
- a processing container configured to accommodate a substrate;
- a processing gas supply configured to supply a processing gas into the processing container;
- an exhaust configured to exhaust an inside of the processing container;
- a heater configured to heat the processing container;
- and
- a cooling gas injector configured to inject a cooling gas for cooling the substrate.
3 more elements
A substrate processing method comprising:
- providing a substrate processing apparatus including a processing container configured to accommodate a substrate, a processing gas supply configured to supply a processing gas into the processing container, an exhaust configured to exhaust an inside of the processing container, a heater configured to heat the processing container, and a cooling gas injector configured to inject a cooling gas to cool the substrate;
- controlling the heater to make a temperature of the processing container reach a temperature set in advance;
- injecting the cooling gas to lower the temperature of the substrate;
- and
- stopping an injection of the cooling gas to raise the temperature of the substrate with a radiant heat from the processing container.
2 more elements
Dependencies are inferred from the claim text.