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US 2023/0416916 A1Published application
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
AssigneeKokusai Electric Corporation
InventorHidehiro YANAI
Life of this patent
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Abstract
A technique includes a process container configured to process a substrate, a storage container which is at least partially in contact with an outer wall of the process container and is configured to store a gas to be supplied into the process container, and a temperature regulator configured to regulate an internal temperature of the storage container.
Claims20
A substrate processing apparatus comprising:
- a process container configured to process a substrate;
- a storage container which is at least partially in contact with an outer wall of the process container and is configured to store a gas to be supplied into the process container;
- and
- a temperature regulator configured to regulate an internal temperature of the storage container.
1 more element
A method of manufacturing a semiconductor device, comprising:
- storing a gas in a storage container which is at least partially in contact with an outer wall of a process container configured to process a substrate, wherein an internal temperature of the storage container is regulated by a temperature regulator;
- and
- supplying the gas, which is stored in the storage container, into the process container.
A non-transitory computer-readable recording medium storing a program that causes, by a computer, a substrate processing apparatus to perform a process comprising:
- storing a gas in a storage container which is at least partially in contact with an outer wall of a process container configured to process a substrate, wherein an internal temperature of the storage container is regulated by a temperature regulator, and
- supplying the gas, which is stored in the storage container, into the process container.
Dependencies are inferred from the claim text.