Methods and apparatus for processing a substrate
AssigneeApplied Materials, Inc.
InventorsYaoying ZHONG, Siew Kit HOI, John KLOCKE, Bridger Earl HOERNER
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Abstract
Methods and apparatus for processing a substrate are provided herein. For example, a method comprises in a process chamber, processing a substrate in a presence of an electric field, subsequently capturing an image of the substrate, determining whether substrate arcing occurred based upon analysis of the captured image, and one of continuing processing of the substrate when no arcing is determined or stopping processing of the substrate when arcing is determined.
Claims20
A method for processing a substrate, comprising:
- in a process chamber, processing a substrate in a presence of an electric field;
- subsequently capturing an image of the substrate;
- determining whether substrate arcing occurred based upon analysis of the captured image;
- and
- one of:
- continuing processing of the substrate when no arcing is determined;
- or
- stopping processing of the substrate when arcing is determined.
A non-transitory computer readable storage medium having instructions stored thereon that when executed by a processor perform a method for processing a substrate, comprising:
- in a process chamber, processing a substrate in a presence of an electric field;
- subsequently capturing an image of the substrate;
- determining whether substrate arcing occurred based upon analysis of the captured image;
- and
- one of:
- continuing processing of the substrate when no arcing is determined;
- or
- stopping processing of the substrate when arcing is determined.
An apparatus for processing a substrate, comprising:
- a process chamber configured to process a substrate in a presence of an electric field;
- an apparatus for capturing an image of the substrate;
- and
- a controller configured to:
- determine whether substrate arcing occurred based upon analysis of the captured image;
- and
- one of:
- continue to process the substrate when no arcing is determined;
- or
- stop processing the substrate when arcing is determined.
Dependencies are inferred from the claim text.