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US 2023/0416520 A1Published application
Epoxy resin composition, gas barrier laminate, and packaging material
AssigneeMitsubishi Gas Chemical Company, Inc.
InventorsNaoko KOBAYASHI, Kazuki KOUNO, Ryoma HASHIMOTO
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Abstract
An epoxy resin composition containing an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and a polyalkylene glycol, as well as a gas barrier laminate and a packaging material in which the epoxy resin composition is used.
Claims12
An epoxy resin composition comprising an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and a polyalkylene glycol.
Dependencies are inferred from the claim text.