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US 2023/0416516 A1Published application
Resin composition, coating solution, film, and multilayer structure
AssigneeMitsubishi Chemical Corporation
InventorsRyohei KOBAYASHI, Yuya KANAMORI
Life of this patent
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Abstract
A resin composition containing: a hydrophilic resin; and a metal compound, wherein a mass ratio between a content of the hydrophilic resin and a content of the metal compound in terms of metal (a content of the hydrophilic resin:a content of the metal compound in terms of metal) is 90:10 to 20:80.
Claims14
A resin composition, comprising:
- a hydrophilic resin;
- and
- a metal compound, wherein
- a mass ratio between a content of the hydrophilic resin and a content of the metal compound in terms of metal (a content of the hydrophilic resin:a content of the metal compound in terms of metal) is 90:10 to 20:80.
1 more element
Dependencies are inferred from the claim text.