Rubber resin material and metal substrate
AssigneeNan Ya Plastics Corporation
InventorsTE-CHAO LIAO, HUNG-YI CHANG
Life of this patent
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Abstract
A rubber resin material and a metal substrate are provided. The rubber resin material includes a resin composition and inorganic fillers. The inorganic fillers are uniformly dispersed in the resin composition. The resin composition includes: 10 wt % to 50 wt % of a liquid rubber, 20 wt % to 60 wt % of a polyphenylene ether resin, and 5 wt % to 60 wt % of a cyanate resin. The polyphenylene ether resin includes a polyphenylene ether that has a bismaleimide group at molecular ends thereof, a polyphenylene ether that has a methacrylate group at molecular ends thereof, a polyphenylene ether that has a styrene group at molecular ends thereof, or a combination thereof. The cyanate resin includes a bisphenol M type cyanate resin.
Claims18
A rubber resin material, comprising a resin composition and inorganic fillers, the inorganic fillers being uniformly dispersed in the resin composition, wherein the resin composition includes:
- 10 wt % to 50 wt % of a liquid rubber;
- 20 wt % to 60 wt % of a polyphenylene ether resin, wherein the polyphenylene ether resin includes a polyphenylene ether that has a bismaleimide group at molecular ends thereof, a polyphenylene ether that has a methacrylate group at molecular ends thereof, a polyphenylene ether that has a styrene group at molecular ends thereof, or a combination thereof;
- and
- 5 wt % to 60 wt % of a cyanate resin, wherein the cyanate resin includes a bisphenol M type cyanate resin.
A metal substrate, comprising a substrate layer and a metal layer disposed on the substrate layer, wherein the substrate layer is formed from a rubber resin material, the rubber resin material includes a resin composition and inorganic fillers, the inorganic fillers are uniformly dispersed in the resin composition, and the resin composition includes:
- 10 wt % to 50 wt % of a liquid rubber;
- 20 wt % to 60 wt % of a polyphenylene ether resin, wherein the polyphenylene ether resin includes a polyphenylene ether that has a bismaleimide group at molecular ends thereof, a polyphenylene ether that has a methacrylate group at molecular ends thereof, a polyphenylene ether that has a styrene group at molecular ends thereof, or a combination thereof;
- and
- 5 wt % to 60 wt % of a cyanate resin, wherein the cyanate resin includes a bisphenol M type cyanate resin.
Dependencies are inferred from the claim text.