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US 2023/0416464 A1Published application
Polyamic acid composition, and polyimide comprising same
AssigneePI Advanced Materials Co., Ltd.
InventorsIn Hwan HWANG, Ik Sang LEE
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Abstract
The present application relates to a polyamic acid composition and a polyimide comprising same, and provides a polyamic acid composition which has a high concentration of polyamic acid solids and a low viscosity and, after hardening, has superior heat resistance, dimensional stability, and mechanical properties, and a polyimide and a polyimide film produced therefrom.
Claims17
A polyamic acid composition comprising polyamic acid including a dianhydride monomer component and a diamine monomer component as a polymerization unit and a solvent,
- wherein the solvent includes a second solvent having a solubility of less than 1.5 g/100 g with respect to the dianhydride monomer.
Dependencies are inferred from the claim text.