Compound, resin composition, resin sheet, resin cured product, and laminated substrate

Abstract

A compound having a chain structure consisting of an aromatic ring group, an ether oxygen atom, a methylene group, an aromatic ring group, a methylene group, an ether oxygen atom, and an aromatic ring group bonded in an order, wherein a hydroxymethyl group is bonded to a carbon atom of the aromatic ring group disposed at a first end of the chain structure, and one end group selected from a hydroxyl group, an amino group, an amide group, and a carboxyl group is bonded to a carbon atom of the aromatic ring group disposed at a second end of the chain structure.

Dependencies are inferred from the claim text.