Thermosetting epoxy resin composition, molded article of same, fiber-reinforced composite material, molding material for fiber-reinforced composite materials, and method for producing fiber-reinforced composite material

Abstract

A purpose of the present invention is to provide a thermosetting epoxy resin composition that manifests latency at a temperature at which the thermosetting resin cures and has an excellent curing rate, and molded articles obtained by thermosetting the same. A further purpose is to provide a fiber-reinforced composite material obtained by blending with reinforcing fibers, a molding material for a fiber-reinforced composite material, and a method for producing a fiber-reinforced composite material. To achieve the above, the thermosetting epoxy resin composition of the present invention is a thermosetting epoxy resin composition including the following constituent elements [a], [b], and [c], wherein the relationship between the curing time (Tc) and the induction time (Ti) satisfies 1<Tc/Ti≤9. [a]: Epoxy resin, [b]: isocyanate compound, [c]: inorganic salt

Dependencies are inferred from the claim text.