Wafer level chip scale package with rhombus shape
AssigneesSilicon Mitus, Inc., Hangzhou Silicon-Magic Semiconductor Technology Co., Ltd.
InventorJi Hoon Hong
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Abstract
The present disclosure relates to a wafer level chip scale package with a rhombus shape which includes a semiconductor chip with a rhombus shape and a solder ball array including a plurality of solder balls formed on one surface of the semiconductor chip. Among four interior angles of the semiconductor chip, two of the four interior angles facing each other in a short diagonal direction are approximately 120°, and two of the four interior angles facing each other in a long diagonal direction are approximately 60°.
Claims5
A wafer level chip scale package with a rhombus shape comprising:
- a semiconductor chip with a rhombus shape;
- and
- a solder ball array comprising a plurality of solder balls formed on one surface of the semiconductor chip, wherein
- among four interior angles of the semiconductor chip, two of the four interior angles facing each other in a short diagonal direction are approximately 120°, and two of the four interior angles facing each other in a long diagonal direction are approximately 60°.
Dependencies are inferred from the claim text.