Apparatus for cutting glass laminated substrate
AssigneeCorning Incorporated
InventorWoo Jin Lee
Life of this patent
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Abstract
Provided is an apparatus for cutting a glass laminated substrate, the apparatus including a first rotating plate, a second rotating plate, and a connection member interposed between the first rotating plate and the second rotating plate and configured to rotate around the first axis, in which a channel having a ring shape surrounding an outer circumferential surface of the connection member is formed between the first rotating plate and the second rotating plate.
Claims20
An apparatus for cutting a glass laminated substrate, the apparatus comprising:
- a first rotating plate configured to rotate around a first axis extending in a first direction parallel to a direction in which an upper surface of the glass laminated substrate extends;
- a first cutter coupled to an edge of the first rotating plate;
- a second rotating plate disposed apart from the first rotating plate in the first direction and configured to rotate around the first axis;
- a second cutter coupled to an edge of the second rotating plate and disposed apart from the first cutter in the first direction;
- and
- a connection member interposed between the first rotating plate and the second rotating plate and configured to rotate around the first axis,
- wherein a channel having a ring shape surrounding an outer circumferential surface of the connection member is formed between the first rotating plate and the second rotating plate.
An apparatus for cutting a glass laminated substrate in which a substrate, an adhesive layer, and a glass layer are sequentially stacked, the apparatus comprising:
- a first rotating plate configured to rotate around a first axis extending in a direction parallel to a first direction in which a surface of the glass laminated substrate extends;
- a first cutter coupled to an edge of the first rotating plate to surround a center portion of the first rotating plate and configured to process the glass layer and a portion of the adhesive layer;
- a second rotating plate disposed apart from the first rotating plate in the first direction and configured to rotate around the first axis;
- a second cutter coupled to an edge of the second rotating plate to surround a center portion of the second rotating plate and configured to process the glass layer and a portion of the adhesive layer;
- a connection member interposed between inner surfaces of the first rotating plate and the second rotating plate and configured to rotate around the first axis,
- wherein a channel having a ring shape surrounding an outer circumferential surface of the connection member is formed between the first rotating plate and the second rotating plate, glass debris of the glass layer that is cut by the first cutter and the second cutter being discharged through the channel.
Dependencies are inferred from the claim text.