3D Printing System with Waste Collection Subsystem

A method of operating a three-dimensional (3D) printing system that is configured to manufacturing a 3D article comprising:

• providing:
• a vessel configured to contain photocurable resin;
• a fabrication subsystem configured to form the 3D article with layer-by-layer selective curing of the photocurable resin, the fabrication subsystem includes;
• a build plate;
• a build plate support structure;
• and
• a vertical movement mechanism;
• and
• a waste collection subsystem attached to the build plate support structure and configured to capture partially polymerized resin as the build plate support structure moves in an upward direction;
• operating the vertical movement mechanism to translate the build plate support structure to a lower position;
• and
• operating the vertical movement mechanism to raise the waste collection subsystem up through the resin and to a position at which partially polymerized resin can be unloaded from the waste collection subsystem.

A three-dimensional (3D) printing system for manufacturing a 3D article comprising:

• a vessel configured to contain photocurable resin, the vessel including at least one wall that defines a wall boundary that laterally encloses the photocurable resin;
• a fabrication subsystem configured to form the 3D article with layer-by-layer selective curing of the photocurable resin, the fabrication subsystem includes:
• a build plate;
• a build plate support structure;
• and
• a vertical movement mechanism;
• a gap is laterally defined between the build plate and the wall boundary;
• a waste collection subsystem including an intake fluidically coupled to a sieve container, the intake laterally positioned within the gap;
• a controller configured to:
• operate the vertical movement mechanism to translate the build plate and the waste collection subsystem up through the photocurable resin and to induce fluid flow of the photocurable resin through the intake and into the sieve container as the build plate is raised.