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US 2023/0415397 A1Published application
Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes
AssigneeNXP USA, Inc.
InventorsSheila F. Chopin, Nishant Lakhera, Boon Yew Low
Life of this patent
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Abstract
An encapsulant compound apparatus, includes a mechanical operator, and an insert disposed on a surface of the mechanical operator. The insert operates to capture foreign material in the encapsulant compound.
Claims21
1-10. (canceled)
A method of processing encapsulant compound, the method comprising:
- processing encapsulant compound with a mechanical operator;
- and
- disposing a first insert on a surface of the mechanical operator, wherein the first insert operates to capture foreign material in the encapsulant compound.
A method of processing encapsulant compound, the method comprising:
- processing encapsulant compound with a mechanical operator characterized as a kneader, the kneader including a kneader cam on a rotator shaft, the kneader cam including the first insert disposed on a kneading surface of the kneading cam;
- and
- wherein the first insert operates to capture foreign material from the encapsulant compound.
Dependencies are inferred from the claim text.