Substrate polishing apparatus and method of polishing substrate using the same

A substrate polishing apparatus comprising:

• a platen having an upper surface, to which a polishing pad including a magnetic material is attached, and installed to be rotatable in one direction;
• a conditioner installed on the polishing pad and configured to modify surface roughness of the polishing pad;
• a magnetic module installed on the polishing pad to be spaced apart from the conditioner in the one direction and including an electromagnet applying magnetic force to polishing pad debris, the polishing pad debris generated on the surface of the polishing pad while the surface of the polishing pad is fine-polished;
• a power supply device configured to supply power for generating the magnetic force to the electromagnet of the magnetic module on the polishing pad;
• and
• a control unit configured to control the power supply device to control an operation of the magnetic module.

A substrate polishing apparatus comprising:

• a polishing pad including a magnetic material;
• a platen having a surface, to which a polishing pad including a magnetic material is attached, and installed to be rotatable in one direction;
• a conditioner installed on the polishing pad and configured to condition a surface of the polishing pad;
• and
• a magnetic module installed on the polishing pad to be spaced apart from the conditioner in the one direction and configured to apply attractive force generated by a magnetic field to polishing pad debris to remove the polishing pad debris from the surface of the polishing pad, the polishing pad debris generated on the surface of the polishing pad while the conditioner conditions the surface of the polishing pad,.