Window logic for control of polishing process
AssigneeApplied Materials, Inc.
InventorsVolker Geissler, Benjamin Cherian
Life of this patent
Estimating the term…
Loading patent…
AssigneeApplied Materials, Inc.
InventorsVolker Geissler, Benjamin Cherian
Estimating the term…
A method of controlling a chemical mechanical polishing system includes receiving a respective time-varying test signal from an endpoint detection system for each of a plurality of test substrates, simultaneously visually displaying the plurality of time-varying test signals on a display with the plurality of time-varying test signals overlaid on each other in a graph. receiving user input selecting a box having a defined time range and defined signal value range, and receiving a selection of one from a preset group of boundary crossing logic functions to provide a selected boundary crossing logic function. During chemical mechanical polishing of a device substrate, the device substrate is monitored with the endpoint detection system to generate a time-varying signal and an endpoint determination can be based on whether the time-varying signal satisfies the selected boundary crossing logic function.
A method of controlling a chemical mechanical polishing system, comprising:
A method of controlling a chemical mechanical polishing system, comprising:
A method of controlling a chemical mechanical polishing system, comprising:
A computer-readable medium tangibly storing instructions that, when executed by one or more processors of a computing device, cause the one or more processors to perform operations comprising:
Dependencies are inferred from the claim text.