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US 2023/0415296 A1Published application
Apparatus and method for cmp temperature control
AssigneeApplied Materials, Inc.
InventorsShou-Sung Chang, Hari Soundararajan, Haosheng Wu, Jianshe Tang
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Abstract
A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature control system including a source of a fluid medium and one or more openings positioned over the platen and separated from the polishing pad and configured for the fluid medium to flow onto the polishing pad to heat or cool the polishing pad.
Claims10
A chemical mechanical polishing apparatus comprising:
- a platen to hold a polishing pad;
- a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process;
- a polishing liquid dispenser having a first port positioned over the platen to deliver polishing liquid onto a first region of the polishing pad;
- a rinse system having a second port positioned over the platen to deliver a rinsing liquid to a different second region of the polishing pad to clean the polishing pad;
- and
- a temperature control system including a source of heated gas and a manifold having plurality of openings positioned over the platen and separated from the polishing pad and configured for the heated gas to flow directly from the plurality of openings onto a different third region of the polishing pad.
3 more elements
Dependencies are inferred from the claim text.