US 2023/0415280 A1Published application

Laser processing equipment and method

AssigneeNational Central University

InventorsChih-Kuang Lin, Jeng-Rong Ho, Pi-Cheng Tung

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Abstract

Laser processing equipment includes a base, a platform, a first image capturing device, a main control device, a second image capturing device and a laser module. The platform, the first and second image capturing device and the laser module are arranged on the top surface of the base and are electrically connected with the main control device. The first image capturing device shoots a workpiece and generates a first image. The main control device searches a target area in the workpiece based on the first image, and the target area includes specific features. The second image capturing device shoots the target area and generates a second image. The main control device performs a feature identification step for specific features based on the first or second image and controls the laser module to process the workpiece based on the result of identification. The invention also provides a laser processing method.

Claims12

Dependent claims

Laser processing equipment for processing a workpiece, the laser processing equipment comprising:

a base having a top surface;
a platform arranged on the top surface and configured for bearing the workpiece;
a first image capturing device arranged on the top surface and suitable for shooting the workpiece and generating a first image;
a main control device electrically connected with the platform and the first image capturing device, the main control device receiving the first image shot by the first image capturing device and searching at least one target area in the workpiece, the at least one target area comprising at least one specific feature;
a second image capturing device arranged on the top surface and electrically connected with the main control device, the second image capturing device shooting the at least one target area and generating a second image, the main control device performing a feature identification step for the at least one specific feature in the at least one target area based on the first image or the second image;
and
a laser module electrically connected with the main control device, the main control device controlling the laser module to perform a laser process on the workpiece based on a result of the feature identification step, wherein
the main control device is capable of controlling relative displacement of the platform, the first image capturing device, the second image capturing device and the laser module;
and
wherein the field of view of the first image capturing device is wider than the field of view of the second image capturing device, and the resolution of the second image capturing device is higher than the resolution of the first image capturing device.

7 more elements

A laser processing method, comprising the following steps:

providing a workpiece, wherein the workpiece comprises at least one target area, and the at least one target area comprises at least one specific feature;
performing a positioning step, shooting, by a first image capturing device, the workpiece and generating a first image, transmitting, by the first image capturing device, the first image to a main control device, and searching, by the main control device, the at least one target area on the workpiece through the first image;
and
if the resolution of the first image is sufficient to perform a feature identification step, then:
performing, by the main control device, the feature identification step based on the first image, performing a contour identification and/or a material identification on the at least one specific feature in the at least one target area;
and
performing a laser processing step, controlling, by the main control device, a laser module to perform a laser process on the specific features based on a result of the feature identification step;
if the resolution of the first image is insufficient to perform the feature identification step, then:
performing a fine positioning step, controlling, by the main control device, a second image capturing device to shoot the at least one target area and generate a second image, and receiving, by the main control device, the second image;
performing, by the main control device, the feature identification step based on the second image, performing the contour identification and/or the material identification on the at least one specific feature in the at least one target area;
and
performing the laser processing step.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 17/938,951Filed 7 Sep 2022
Priority: TW 11112410928 Jun 2022
Published: 28 Dec 2023
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

B23K 26/032
Observing, e.g. monitoring, the workpiece: using optical means
B23K 37/0461
For holding or positioning work: welding tables
B23K 26/0622
By direct control of the laser beam: by shaping pulses
B23K 26/083
Devices involving relative movement between laser beam and workpiece: devices involving movement of the workpiece in at least one axial direction