Laser machining head, and laser machining system comprising same
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHISAYUKI OGUCHI, WATARU TAKAHASHI
Life of this patent
Estimating the term…
Loading patent…
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsHISAYUKI OGUCHI, WATARU TAKAHASHI
Estimating the term…
Laser processing head (10) includes housing (11) and a plurality of optical components. Housing (11) includes first and second light entrance ports (12a) and (12b) through which first and second laser beams (A) and (B) are incident, and light irradiation port (13). Second laser beam (B) has a wavelength different from first laser beam (A). The plurality of optical components include bend mirror (30), dichroic mirror (40), aperture (71), and detection-side condensing lens (70). First and second laser beams (A) and (B) transmitted through detection-side condensing lens (70) are received by image sensor (60). Aperture (71) is configured to be able to reduce diameters of first and second laser beams (A) and (B) incident on detection-side condensing lens (70).
A laser processing head comprising:
Dependencies are inferred from the claim text.