Apparatus for cleaning a back side of a substrate and method of cleaning a back side of a substrate
AssigneeSemes Co., Ltd.
InventorsSunghun EOM, Kangsul KIM, Youngjun SON, Seongyeol CHOI
Life of this patent
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Abstract
An apparatus for cleaning a back side of a substrate may include a cleaning assembly which may include a cleaning solution supply part receiving a cleaning solution and an ultrasonic wave supply part applying an ultrasonic wave to the cleaning solution such that a column of the cleaning solution is formed from the cleaning solution supply part toward the back side of the substrate. The back side of the substrate may be cleaned by contacting the column of the cleaning solution with the back side of the substrate.
Claims20
An apparatus for cleaning a back side of a substrate comprising:
- a cleaning assembly, the cleaning assembly comprising:
- a cleaning solution supply part receiving a cleaning solution:
- and
- an ultrasonic wave supply part applying an ultrasonic wave to the cleaning solution such that a column of the cleaning solution is formed from the cleaning solution supply part toward the back side of the substrate,
- wherein the back side of the substrate is cleaned by contacting the column of the cleaning solution with the back side of the substrate.
An apparatus for cleaning a back side of a substrate comprising:
- a part for rotating a substrate supporting a central portion of the back side of the substrate and rotating the substrate;
- a cleaning assembly, the cleaning assembly comprising:
- a cleaning solution supply part receiving a cleaning solution:
- and
- an ultrasonic wave supply part applying an ultrasonic wave to the cleaning solution such that a column of the cleaning solution is formed from the cleaning solution supply part toward the back side of the substrate,
- a positioning part adjusting a height of the cleaning assembly such that the column of the cleaning solution contacts the back side of the substrate.
A method of cleaning a back side of a substrate, comprising:
- providing a cleaning solution;
- forming a column of the cleaning solution by applying an ultrasonic wave to the cleaning solution;
- and
- cleaning the back side of the substrate by contacting the column of the cleaning solution with the back side of the substrate.
Dependencies are inferred from the claim text.