Buffer chamber, substrate treating apparatus and substrate treating method

A buffer chamber comprising:

• a chuck for supporting and rotating a substrate;
• a first liquid supply unit configured to supply a first liquid to a first surface of the substrate supported at the chuck;
• and
• a second liquid supply unit configured to supply a second liquid which has a higher volatility than the first liquid to a second surface, which is different from the first surface, of the substrate supported at the chuck.

A substrate treating apparatus comprising:

• a first process treating unit for treating a substrate in a batch-type manner;
• a second process treating unit for treating the substrate in a single-type manner;
• and
• a controller,
• wherein the first process treating unit includes a batch-type treating bath for treating substrates in a vertical posture, and
• wherein the second process treating unit includes:
• a single-type liquid treating chamber for liquid treating the substrate by supplying a treating liquid to the substrate which is rotating;
• single-type drying chamber for dry treating the substrate by supplying a supercritical fluid to the substrate;
• a buffer chamber for supplying a liquid to the substrate so a wetting state of the substrate may be maintained;
• and
• a transfer robot for transferring the substrate between the buffer chamber, the single-type liquid treating chamber, and the single-type drying chamber.