Display device and manufacturing method of display device

A manufacturing method of a display device, comprising:

• preparing a processing substrate by
• forming a first lower electrode and a second lower electrode above a substrate,
• forming a rib on the first lower electrode and the second lower electrode, the rib being formed of a first inorganic insulating material and including a first aperture overlapping the first lower electrode and a second aperture overlapping the second lower electrode, and
• forming a partition on the rib, the partition including
• a lower portion on the rib and between the first aperture and the second aperture, and
• an upper portion on the lower portion and extending beyond a side surface of the lower portion;
• forming a first organic layer on the rib and the partition, the first organic layer including a first light-emitting layer and being in contact with the first lower electrode at the first aperture;
• forming a first upper electrode on the first organic layer;
• forming a first transparent layer on the first upper electrode, the first transparent layer being formed of a first organic material;
• forming a second transparent layer on the first transparent layer, the second transparent layer being formed of a second organic material different from the first organic material;
• forming a first sealing layer on the second transparent layer, the first sealing layer being formed of a second inorganic insulating material;
• forming a first patterned resist on the first sealing layer, the first patterned resist covering a first portion of the first sealing layer above the first lower electrode and a second portion of the first sealing layer above a first part of the upper portion of the partition, and the first patterned resist exposing a third portion of the first sealing layer above the second lower electrode and a fourth portion of the first sealing layer above a second part of the upper portion of the partition;
• removing the third portion of the first sealing layer to expose a portion of the second transparent layer by a first dry etching;
• removing the portion of the second transparent layer to expose a portion of the first transparent layer by a second dry etching using an oxygen plasma;
• removing the portion of the first transparent layer to expose a portion of the first upper electrode by the second dry etching;
• removing the portion of the first upper electrode to expose a portion of the first organic layer by a first wet etching;
• removing the portion of the first organic layer by a third dry etching using the oxygen plasma, and
• removing the first patterned resist.