Flip-chip Light Emitting Diode and Manufacturing Method Thereof
AssigneeXiamen San'an Optoelectronics Co., Ltd.
InventorsWei-ping XIONG, Shu-Fan YANG, Chun-Yi WU, Chaoyu WU
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Abstract
A flip-chip light emitting diode includes a light-emitting epitaxial laminated layer having a first surface, and a second surface opposing the first surface, and including a first semiconductor layer, an active layer, and a second semiconductor layer, wherein the first surface is a roughened surface; a transparent bonding medium layer over the first surface of the light-emitting epitaxial laminated layer and bonded with a transparent substrate; and a first electrode and a second electrode respectively over a first electrode region and a second electrode region over the second surface of the light-emitting epitaxial laminated layer.
Claims20
A flip-chip light emitting diode comprising:
- a light-emitting epitaxial laminated layer having a first surface, and a second surface opposing the first surface, and including a first semiconductor layer, an active layer, and a second semiconductor layer, wherein the first surface is a roughened surface;
- a transparent bonding medium layer over the first surface of the light-emitting epitaxial laminated layer and bonded with a transparent substrate;
- a first electrode and a second electrode respectively over a first electrode region and a second electrode region over the second surface of the light-emitting epitaxial laminated layer;
- wherein the transparent substrate has a thickness of less than 80 μm;
- wherein the transparent bonding medium layer includes a first sub-layer and a second sub-layer, wherein the first sub-layer is adjacent to the first surface of the light-emitting epitaxial laminated layer, and the second sub-layer is adjacent to the transparent substrate;
- wherein the first sub-layer has a refractive index larger than a refractive index of the second sub-layer;
- and
- wherein the transparent bonding medium layer has a flat upper surface.
A flip-chip light emitting diode comprising:
- a light-emitting epitaxial laminated layer having a first surface and a second surface opposing the first surface, and including a first semiconductor layer, an active layer and a second semiconductor layer;
- a transparent bonding medium layer over the first surface of the light-emitting epitaxial laminated layer and bonded with a transparent substrate;
- a first electrode and a second electrode respectively over a first electrode region and a second electrode region over the second surface of the light-emitting epitaxial laminated layer;
- wherein the transparent substrate has a thickness of less than 80 μm;
- wherein the transparent bonding medium layer comprises a high-refractivity transparent medium layer and a transparent bonding layer, wherein:
- the high-refractivity transparent medium layer is over the first surface of the light-emitting epitaxial laminated layer;
- and the transparent bonding layer is over the high-refractivity transparent medium layer;
- and
- wherein the transparent bonding layer has a flat upper surface.
A light-emitting device comprising one or more light emitting diodes including at least one light emitting diode comprising:
- a light-emitting epitaxial laminated layer having a first surface and a second surface opposing the first surface, and including a first semiconductor layer, an active layer and a second semiconductor layer, wherein the first surface is a roughened surface;
- a transparent bonding medium layer over the first surface of the light-emitting epitaxial laminated layer and bonded with a transparent substrate;
- a first electrode and a second electrode respectively over a first electrode region and a second electrode region over the second surface of the light-emitting epitaxial laminated layer;
- wherein the transparent substrate has a thickness of less than 80 μm;
- wherein the transparent bonding medium layer including a first sub-layer and a second sub-layer which the first sub-layer is adjacent to the first surface of the light-emitting epitaxial laminated layer, and the second sub-layer is adjacent to the transparent substrate;
- wherein the first sub-layer has a refractive index larger than a refractive index of the second sub-layer;
- and
- wherein the transparent bonding medium layer has a flat upper surface.
Dependencies are inferred from the claim text.