Optical sensor and manufacturing method thereof
AssigneeJapan Display Inc.
InventorJun NITTA
Life of this patent
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Abstract
An optical sensor includes: a substrate; a pixel electrode provided on the substrate; an organic photoelectric conversion layer laminated on a surface of the pixel electrode; and a common electrode laminated on a surface of the organic photoelectric conversion layer, wherein in a cross-sectional view, the surface of the pixel electrode is heightened gradually or stepwise from an end portion closest to the substrate in a direction perpendicular to the substrate toward a top portion farthest from the substrate in the direction perpendicular to the substrate, and the surface of the organic photoelectric conversion layer and a surface of the common electrode each have a shape corresponding to a shape of the surface of the pixel electrode.
Claims7
An optical sensor comprising:
- a substrate;
- a pixel electrode provided on the substrate;
- an organic photoelectric conversion layer laminated on a surface of the pixel electrode;
- and
- a common electrode laminated on a surface of the organic photoelectric conversion layer, wherein
- in a cross-sectional view, the surface of the pixel electrode is heightened gradually or stepwise from an end portion closest to the substrate in a direction perpendicular to the substrate toward a top portion farthest from the substrate in the direction perpendicular to the substrate, and
- the surface of the organic photoelectric conversion layer and a surface of the common electrode each have a shape corresponding to a shape of the surface of the pixel electrode.
A method for manufacturing an optical sensor comprising:
- a first conductive film forming step of forming a first conductive film on a substrate;
- a resist film forming step of forming a resist film on the first conductive film;
- a first conductive film etching step of etching the first conductive film;
- a simultaneously etching step of simultaneously etching the resist film and the first conductive film;
- a resist film removing step of removing the resist film;
- an organic photoelectric conversion film forming step of forming an organic photoelectric conversion film on the first conductive film;
- and
- a second conductive film forming step of forming a second conductive film on the organic photoelectric conversion film, wherein
- in the simultaneously etching step, the first conductive film is processed such that, in a cross-sectional view, the surface of the first conductive film is heightened gradually or stepwise from an end portion closest to the substrate in a direction perpendicular to the substrate toward a top portion farthest from the substrate in the direction perpendicular to the substrate,
- in the organic photoelectric conversion film forming step, the organic photoelectric conversion film is formed such that a surface of the organic photoelectric conversion film has a shape corresponding to a shape of the surface of the first conductive film, and
- in the second conductive film forming step, the second conductive film is formed such that a surface of the second conductive film has a shape corresponding to a shape of the surface of the first conductive film.
Dependencies are inferred from the claim text.