3d flash memory device and method of manufacturing the same
AssigneeMacronix International Co., Ltd.
InventorsHang-Ting Lue, Teng Hao Yeh, Cheng-Yu Lee, Wei-Chen Chen
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AssigneeMacronix International Co., Ltd.
InventorsHang-Ting Lue, Teng Hao Yeh, Cheng-Yu Lee, Wei-Chen Chen
Estimating the term…
A three-dimensional flash memory device may be a AND flash memory device. The three-dimensional flash memory device includes: a substrate, a gate stack structure, a plurality of slit structures, a plurality of memory arrays, and a plurality of conductive pillars. The gate stack structure is located above the substrate. The plurality of slit structures extend through the gate stack structure and divide the gate stack structure into a plurality of blocks. The plurality of memory arrays are disposed in the gate stack structure of the plurality of blocks. The plurality of conductive pillars extends through the gate stack structure in the plurality of blocks, and disposed between the plurality of memory arrays and between the plurality of slit structures.
A three dimensional flash memory device, comprising:
A method of manufacturing a three dimensional flash memory device, comprising:
A three dimensional flash memory chip, comprising:
Dependencies are inferred from the claim text.