Semiconductor device and method for manufacturing the same

A method for manufacturing a semiconductor device, comprising:

• forming a circuit board, the circuit board comprising a plurality of circuit structures and a plurality of wires, the circuit structures being electrically connected to the corresponding wires, and the circuit board having a peripheral area, an array area and a staircase area disposed between the peripheral area and the array area;
• forming a bottom plate disposed over the circuit board, and the bottom plate comprising a bottom conductive layer;
• forming a plurality of landing pads embedded in at least a top portion of the bottom conductive layer and contacting the bottom conductive layer in the staircase area;
• forming a stack disposed on the bottom plate, and the stack comprising a plurality of conductive layers and a plurality of insulating layers alternately stacked along a first direction;
• forming a plurality of support pillars passing through the stack along the first direction and extending to the landing pads in the staircase area;
• and
• forming a plurality of memory pillars passing through the stack along the first direction in the array area.