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AssigneeTelefonaktiebolaget LM Ericsson (publ)
InventorsClaudio D'Incà, Gianni PAPARELLA, Marco Assale, Sergio Lanzone, Sergio Mosti, Angelo Graci
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Embodiments described herein relate to apparatuses for reducing the effect of oscillations of a heat sink. A heat sink apparatus is provided for use with an interface module comprising a cage configured to receive a pluggable signal connector, wherein the cage comprises a first surface configured to couple to a circuit board. The heat sink apparatus comprises a heat sink, wherein the heat sink comprises: a first portion configured to couple into thermal contact with a second surface of the cage; a second portion, wherein the second portion is configured to extend beyond at least one of the dimensions of the cage in a plane parallel to the circuit board; a dampener coupled to the second portion of the heat sink, wherein the dampener is configured to dampen oscillations of the second portion in a direction perpendicular to the plane of the circuit board, and a first coupler coupled to the second portion of the heat sink for providing physical coupling between the heat sink and a second coupler on the circuit board during oscillations of the second portion in directions parallel to the plane of the circuit board.
A heat sink apparatus for use with an interface module comprising a cage configured to receive a pluggable signal connector, wherein the cage comprises a first surface configured to couple to a circuit board, the heat sink apparatus comprising:
A system comprising:
A system comprising:
Dependencies are inferred from the claim text.