Heat sink and electronic device having the heat sink
AssigneeFulian Precision Electronics (Tianjin) Co., LTD.
InventorXIANG-WU CHEN
Life of this patent
Estimating the term…
Abstract
A heat sink includes a substrate, a heat pipe embedded in the substrate, a first fin group, and a plurality of heat conducting members. The substrate includes a first surface and a second surface facing away from the first surface. The first fin group is arranged on the first surface. A part of each of the plurality of heat conducting members is embedded in the substrate from the second surface and contacts the heat pipe, the other part of each of the plurality of heat conducting members is located outside of the substrate. An electronic device having the heat sink is also provided.
Claims20
A heat sink comprising:
- a substrate comprising a first surface and a second surface facing away from the first surface;
- a heat pipe embedded in the substrate;
- a first fin group on the first surface;
- and
- a plurality of heat conducting members, wherein a part of each of the plurality of heat conducting members is embedded in the substrate from the second surface and contacts the heat pipe, the other part of each of the plurality of heat conducting members is located outside of the substrate.
An electronic device comprising:
- a plurality of heat sources;
- and
- a heat sink comprising:
- a substrate comprising a first surface and a second surface facing away from the first surface;
- a heat pipe embedded in the substrate;
- a first fin group on the first surface;
- and
- a plurality of heat conducting members, wherein a part of each of the plurality of heat conducting members is embedded in the substrate from the second surface and contacts the heat pipe, the other part of each of the plurality of heat conducting members is located outside of the substrate;
- wherein each of the plurality of heat conducting members contacts one of the plurality of heat sources.
Dependencies are inferred from the claim text.