Method for manufacturing heat dissipation structure of electronic element, heat dissipation structure, and electronic device

A method for manufacturing a heat dissipation structure of an electronic element, comprising:

• placing a substrate having an electronic element in an environment that meets a preset temperature condition;
• and
• in the environment that meets the preset temperature condition, covering a periphery of the electronic element with a heat dissipation cover, fixedly connecting the heat dissipation cover to the substrate, and placing a solid-state phase-change thermally conductive material in an accommodation cavity surrounded by the substrate and the heat dissipation cover;
• the covering a periphery of the electronic element with a heat dissipation cover, fixedly connecting the heat dissipation cover to the substrate, and placing a solid-state phase-change thermally conductive material in an accommodation cavity surrounded by the substrate and the heat dissipation cover comprises:
• after the phase-change thermally conductive material is constructed into a sheet-like structure, sticking the sheet-like structure to an inner surface of a top wall of the heat dissipation cover, to form an integrated structure;
• and
• covering the periphery of the electronic element with the integrated structure, and fixedly connecting the integrated structure to the substrate.

A heat dissipation structure of an electronic element, comprising:

• a substrate, provided with an electronic element;
• a heat dissipation cover, connected to the substrate and surrounding the electronic element, wherein the heat dissipation cover and the substrate form an accommodation cavity that accommodates the electronic element;
• and
• a phase-change thermally conductive material, disposed in the accommodation cavity, wherein a melting point of the phase-change thermally conductive material is 35˜65° C.;
• the heat dissipation structure further comprises a heat dissipation module attached to a top wall of the heat dissipation cover;
• an opening is disposed on the top wall, a thermally conductive column protrudes from an outer wall of the heat dissipation module, and the thermally conductive column passes through the opening and extends into the accommodation cavity.

An electronic device, comprising:

• a heat dissipation structure, comprising:
• a substrate, provided with an electronic element;
• a heat dissipation cover, connected to the substrate and surrounding the electronic element, wherein the heat dissipation cover and the substrate form an accommodation cavity that accommodates the electronic element;
• and
• a phase-change thermally conductive material, disposed in the accommodation cavity, wherein a melting point of the phase-change thermally conductive material is 35˜65° C.;
• the heat dissipation structure further comprises a heat dissipation module attached to a top wall of the heat dissipation cover;
• an opening is disposed on the top wall, a thermally conductive column protrudes from an outer wall of the heat dissipation module, and the thermally conductive column passes through the opening and extends into the accommodation cavity.