Metallic thermal interface materials and associated devices, systems, and methods
AssigneeDeeia Inc.
InventorHimanshu Pokharna
Life of this patent
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Abstract
A heat-transfer component defines a thermal-interface surface and has a metallic thermal-interface material bonded to the thermal-interface surface. The metallic thermal-interface material has a solid-to-liquid phase-change temperature between about 60° C. and about 90° C. With a thermal-interface material bonded to the thermal-interface surface, the thermal-contact resistance between the thermal-interface material and the heat-transfer component can be reduced or substantially eliminated compared to conventional thermal-interface materials, including conventional metallic thermal-interface materials. Also disclosed are electrical devices having a heat generating component cooled by such a heat-transfer component.
Claims34
An integrated heat-spreader configured to overlie an integrated-circuit die, the integrated heat-spreader comprising:
- a first major surface defining a thermal-interface surface and being configured to face a heat-removal device;
- a second major surface positioned opposite the thermal-interface surface and being configured to face the integrated-circuit die;
- and
- a metallic thermal-interface material bonded to the thermal-interface surface, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C.
(canceled)
A heat-removal device configured to dissipate heat received from a heat-generating electronic component, the heat-removal device comprising:
- a base defining a first major surface and a second major surface opposite the first major surface;
- a metallic thermal-interface material bonded to the first major surface, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C.;
- and
- a plurality of fins extending from the second major surface.
An electrical device, comprising:
- a heat-generating component defining a first thermal-interface surface;
- an integrated heat spreader configured to overlie the heat-generating component, the integrated heat spreader defining a first major surface and a second major surface positioned opposite the first major surface, the first major surface being configured to face a heat-removal device and the second major surface being configured to face the heat-generating component;
- and
- a metallic thermal-interface material bonded to the second major surface of the integrated heat spreader, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C.
(canceled)
An electrical device, comprising:
- a heat-generating component defining a first thermal-interface surface;
- a heat-removal device configured to dissipate heat received from the heat-generating electronic component, the heat-removal device having a base defining a first major surface and further defining a second major surface opposite the first major surface, wherein a plurality of fins extends from the second major surface of the heat-removal device, and wherein a metallic thermal-interface material is bonded to the first major surface of the base, the metallic thermal-interface material having a solid-to-liquid transition temperature between about 60° C. and about 90° C.
Dependencies are inferred from the claim text.