Heat Dissipating Object with Self Sealing Plug Allowing for a Thermal Interface Material with Fluidity for an Electronic Device

A heat-dissipating object allowing for a thermal interface material (TIM) with fluidity to transfer heat from an electronic device, comprising:

• a base plate having a top surface and a bottom surface and one or more self-sealing plug structures, a sealing ring, a liquid-storage tube integrated with a self-sealing plug structure,
• wherein the sealing ring is mounted at the bottom surface of the base plate, directly sealing a peripheral region at a top surface of the electronic device to provide a sealed gap between a portion of the bottom surface of the base plate and a portion of the top surface of the electronic device;
• wherein each self-sealing plug structure includes a chamber with a self-sealing block mounted inside;
• wherein the liquid-storage tube has two ends, one end is connected to the sealed gap through a connecting hole, and another end is integrated with the self-sealing plug structures;
• wherein the one or more self-sealing plug structures of the base plate are positioned at the top surface of the base plate and connected to the sealed gap through one or more connecting holes;
• and
• wherein the sealed gap is entirely filled with a thermal interface material with fluidity, a portion of the liquid-storage tube is filled with the same thermal interface material, and the remaining portion of the liquid-storage tube is filled with a gas.