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US 2023/0413449 A1Published application
Method for fabricating electronic circuit and metal ion solution
AssigneeNational Tsing Hua University
InventorsMing-Tsang Lee, Yu-Bin Chen, Swami Siddharth
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Abstract
Provided is a method of fabricating an electronic circuit including providing a copper ion solution. The copper ion solution includes a source of copper (II) ions, L-ascorbic acid, and water. The copper ion solution is applied on a substrate to form a coating layer. A heat source is provided to locally heat the coating layer to react copper ions in the coating layer to form copper conductive patterns.
Claims17
A method of fabricating an electronic circuit, comprising:
- providing a copper ion solution mainly formed by the following components:
- a source of copper (II) ions;
- L-ascorbic acid;
- and
- water;
- applying the copper ion solution on a substrate to form a coating layer;
- and
- providing a heat source to locally heat the coating layer to react copper ions in the coating layer to form a plurality of copper conductive patterns.
5 more elements
A metal ion solution mainly formed by the following components:
- a source of copper (II) ions;
- L-ascorbic acid;
- and
- water.
1 more element
Dependencies are inferred from the claim text.