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US 2023/0413439 A1Published application
Wiring board and module
AssigneeMurata Manufacturing Co., Ltd.
InventorIssei YAMAMOTO
Life of this patent
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Abstract
Wiring board includes rigid board and flexible board laminated on rigid board. Cavity recessed in thickness direction of rigid board is formed in surface of rigid board which is located on flexible board side. Side surface and bottom surface of cavity are formed of rigid board. Top surface of cavity is formed of flexible board.
Claims20
A wiring board comprising:
- a rigid board;
- and
- a flexible board laminated on the rigid board, wherein
- a cavity recessed in a thickness direction of the rigid board is provided in a surface of the rigid board facing the flexible board, wherein
- a side surface and a bottom surface of the cavity are comprised of the rigid board, and wherein
- a top surface of the cavity is comprised of the flexible board.
3 more elements
Dependencies are inferred from the claim text.