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US 2023/0413437 A1Published application
Printed circuit board
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorKye Hwan LEE
Life of this patent
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Abstract
A printed circuit board includes a first insulating layer, a first pad embedded in one surface side of the first insulating layer and having one surface exposed from one surface of the first insulating layer, and a first surface treatment layer disposed on the exposed one surface of the first pad. A boundary surface between the first pad and the first surface treatment layer is substantially coplanar with the one surface of the first insulating layer.
Claims20
A printed circuit board, comprising:
- a first insulating layer;
- a first pad embedded in one surface side of the first insulating layer and having one surface exposed from one surface of the first insulating layer;
- and
- a first surface treatment layer disposed on the exposed one surface of the first pad,
- wherein a boundary surface between the first pad and the first surface treatment layer is substantially coplanar with the one surface of the first insulating layer.
2 more elements
A printed circuit board, comprising:
- a first insulating layer;
- a first pad embedded in one surface side of the first insulating layer and having one surface exposed from one surface of the first insulating layer;
- and
- a second pad embedded in the one surface side of the first insulating layer and having one surface exposed from the one surface of the first insulating layer,
- wherein the one surface of the second pad and the one surface of the first insulating layer have a step difference therebetween.
2 more elements
A printed circuit board, comprising:
- an insulating layer;
- a pad embedded in the insulating layer, and having one surface exposed from one surface of the insulating layer and substantially coplanar with the one surface of the insulating layer;
- and
- a first solder resist layer disposed on the one surface of the insulating layer, and having an opening exposing a region of the insulating layer where the pad is embedded.
1 more element
Dependencies are inferred from the claim text.