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US 2023/0413433 A1Published application
Electronic device and method of forming electronic device
AssigneeInnolux Corporation
InventorsCheng-Chi WANG, Cheng-Hsien HO, Kuo-Sheng YEH, Jui-Jen YUEH
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Abstract
An electronic device includes a first electronic unit, a second electronic unit, a bonding pad, an insulating layer and a circuit layer. The bonding pad is disposed between the first electronic unit and the second electronic unit. The insulating layer is disposed corresponding to the first electronic unit, to the second electronic unit and to the bonding pad. The first electronic unit is electrically connected with the second electronic unit through the circuit layer and through the bonding pad.
Claims20
An electronic device, comprising:
- a first electronic unit and a second electronic unit;
- a bonding pad disposed between the first electronic unit and the second electronic unit;
- an insulating layer disposed corresponding to the first electronic unit, to the second electronic unit and to the bonding pad;
- and
- a circuit layer;
- wherein, the first electronic unit is electrically connected to the second electronic unit through the circuit layer and through the bonding pad.
3 more elements
A method of forming an electronic device, comprising:
- providing a substrate comprising a bonding pad, a first electronic unit and a second electronic unit;
- and
- providing an insulating layer on the substrate, wherein the insulating layer is correspondingly provided with respect to the bonding pad, to the first electronic unit and to the second electronic unit;
- wherein, the bonding pad is disposed between the first electronic unit and the second electronic unit, and the bonding pad is electrically connected to the first electronic unit and to the second electronic unit.
1 more element
Dependencies are inferred from the claim text.