Printed Circuit Board and Manufacturing Method Thereof
AssigneeUnimicron Technology Corp.
InventorsPo-Hsiang Wang, Ming-Hao Wu
Life of this patent
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Abstract
The present disclosure provides a printed circuit board and a method thereof. The printed circuit board has a first substrate, at least one first trace layer and at least one second trace layer. The first substrate has a first surface and a second surface. The first surface and the second surface are corresponding to each other along an axis. The first trace layer is formed on the first surface and/or the second surface of the first substrate. The first trace layer has at least one first trace and at least one first gap beside the first trace by etching. The second trace layer is formed on the first trace layer. The second trace layer has at least one second trace and at least one second gap beside the second trace by etching.
Claims16
A printed circuit board comprising:
- a first substrate, having a first surface and a second surface, the first surface and the second surface being corresponding to each other along an axis;
- at least one first circuit layer, formed on the first surface and/or the second surface of the first substrate, the first circuit layer having at least one first trace and at least one first gap beside the first trace by etching, wherein an etching factor of the first trace is greater than or equal to 2.3;
- and
- at least one second circuit layer, formed on the first circuit layer, the second circuit layer having at least one second trace and at least one second gap beside the second trace by etching, wherein an etching factor of the second trace is greater than or equal to 2.3;
- wherein the first trace and the second trace are connected with each other along the axis in order to form a stacked trace, and an etching factor of the stacked trace is greater than or equal to 4.6.
A method for manufacturing a printed circuit board, comprising:
- providing a first substrate having a first surface and a second surface, the first surface and the second surface being corresponding to each other along an axis;
- providing at least one first circuit layer formed on the first surface and/or the second surface of the first substrate, wherein the first circuit layer has at least one first trace and at least one first gap beside the first trace by etching, wherein an etching factor of the first trace is greater than or equal to 2.3;
- forming at least one second circuit layer on the first circuit layer, wherein the second circuit layer has at least one second trace and at least one second gap beside the second trace by etching, wherein an etching factor of the second trace is greater than or equal to 2.3;
- and
- forming a stacked trace by way of the first trace and the second trace being connected with each other along the axis, and an etching factor of the stacked trace being greater than or equal to 4.6.
Dependencies are inferred from the claim text.