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US 2023/0413428 A1Published application
Extensible and contractible wiring board and method for manufacturing extensible and contractible wiring board
AssigneeMurata Manufacturing Co., Ltd.
InventorTakayoshi OBATA
Life of this patent
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Abstract
An extensible and contractible wiring board that includes an extensible and contractible wiring sheet having an extensible and contractible resin sheet and an extensible and contractible wiring on the extensible and contractible resin sheet, the extensible and contractible wiring including a conductive particle, a resin, and a void at an interface between the conductive particle and the resin; and a fixing sheet on a main surface of the extensible and contractible wiring sheet.
Claims8
A method for manufacturing an extensible and contractible wiring board, the method comprising:
- applying a first tensile stress to an extensible and contractible wiring sheet that includes an extensible and contractible resin sheet and an extensible and contractible wiring formed on the extensible and contractible resin sheet;
- relaxing the first tensile stress;
- applying a second tensile stress to the extensible and contractible wiring sheet after relaxing the first tensile stress;
- and
- securing a fixing sheet to a main surface of the extensible and contractible wiring sheet in a state in which the second tensile stress is applied.
2 more elements
Dependencies are inferred from the claim text.