3d glass modules
AssigneeElectronic Design & Development, Corp.
InventorSergio E. Cardona, Jr.
Life of this patent
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Abstract
A hermetic glass module for wireless communication. In some embodiments, the module may comprise a plurality of glass layers comprising a first layer having capacitors, inductors, and resonators, a second layer comprising capacitors, inductors, diplexers, and waveguides, a third layer comprising microchips, and capacitors, and a fourth layer comprising a glass cover layer, and antennas disposed within the glass cover layer. The plurality of glass layers may each be separated by a substrate of a plurality of substrates and are connected by a redistribution layer (RDL) of a plurality of RDLs.
Claims19
A multilayer hermetic glass module (100) for wireless communication, the module (100) comprising a plurality of glass layers each separated by a substrate of a plurality of substrates and connected by a redistribution layer (RDL) of a plurality of RDLs, wherein one or more electronic components are disposed within the plurality of glass layers.
A hermetic glass module (100) for wireless communication, the module (100) comprising a plurality of glass layers comprising:
- a. a first layer (110) comprising:
- i. a first set of one or more capacitors (114);
- ii. a first set of one or more inductors (115);
- and
- iii. a set of one or more resonators (122, 123);
- b. a second layer (120) comprising:
- i. a second set of one or more capacitors (125);
- ii. a second set of one or more inductors (126);
- iii. a set of one or more diplexers (127);
- and
- iv. a set of one or more waveguides (128);
- c. a third layer (130) comprising:
- i. a set of one or more microchips (134);
- and
- ii. a third set of one or more capacitors (135);
- and
- d. a fourth layer (140) comprising:
- i. a glass cover layer (142);
- and
- ii. one or more antennas (143) disposed within the glass cover layer (142);
- wherein the plurality of glass layers are each separated by a substrate of a plurality of substrates and are connected by a redistribution layer (RDL) of a plurality of RDLs.
A hermetic glass module (100) for wireless communication, the module (100) comprising:
- a. a first layer (110) comprising:
- i. a first substrate (111);
- ii. a first glass wall (112) disposed around a perimeter of the substrate, the first glass wall (112) encompassing a first gap (113);
- iii. a first set of one or more capacitors (114) disposed within the first glass wall (112);
- and
- iv. a first set of one or more inductors (115) disposed within the glass wall;
- b. a second layer (120) coupled to the first layer (110) by a redistribution layer (RDL), comprising:
- i. a second substrate (121) disposed on top of the glass wall of the first layer (110);
- ii. a bulk acoustic wave (BAW) resonator (122) disposed on a bottom surface of the second substrate (121) such that the BAW resonator (122) is disposed in the first gap (113);
- iii. a surface acoustic wave (SAW) resonator (123) disposed on a bottom surface of the second substrate (121) such that the SAW resonator (123) is disposed in the first gap (113);
- iv. a glass layer (124) disposed on top of the second substrate (121), wherein the glass layer (124) is divided horizontally into a first sublayer and a second sublayer;
- v. a second set of one or more capacitors (125) disposed within the glass layer (124);
- vi. a second set of one or more inductors (126) disposed within the glass layer (124);
- vii. one or more diplexers (127) disposed within the glass layer (124);
- and
- viii. one or more waveguides (128) disposed within the glass layer (124);
- c. a third layer (130) coupled to the second layer (120) by a RDL, comprising:
- i. a third substrate (131) disposed on top of the glass layer (124);
- ii. a second glass wall (132) disposed around a perimeter of the third substrate (131), the second glass wall (132) enclosing a second gap (133);
- iii. one or more microchips (134) disposed on a top surface of the third substrate (131) such that the one or more microchips (134) are disposed within the second gap (133);
- and
- iv. a third set of one or more capacitors (135) disposed within the second glass wall (132);
- and
- d. a fourth layer (140) coupled to the third layer (130) by a RDL, comprising:
- i. a fourth substrate (141) disposed on top of the second glass wall (132);
- ii. a glass cover layer (142) disposed on top of the fourth substrate (141);
- and
- iii. one or more antennas (143) disposed within the glass cover layer (142).
Dependencies are inferred from the claim text.