# US 2023/0412142 A1 · Piezoelectric layer arrangements in acoustic wave devices and related methods > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0412142 A1 - Document ID: US20230412142A1 - Status: Published application - Kind: A1 - Application number: 18/252,173 - Filed: 2020-11-16 - Published: 2023-12-21 - Earliest claimed: 2020-11-16 - Assignees: Qorvo US, Inc. - Applicants: Qorvo US, Inc. - Inventors: Patrik Rath - Web page: https://patentgrep.com/patent/US20230412142A1 ## CPC - H03H 9/02818: {Means for compensation or elimination of undesirable effects} - H03H 3/08: for the manufacture of resonators or networks using surface acoustic waves - H03H 9/02574: {of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate} - H03H 9/02622: {of the surface, including back surface} - H03H 9/02834: {of temperature influence (cut angles H03H9/02543)} - H03H 9/14544: {Transducers of particular shape or position (weighting H03H9/14517)} - H03H 9/6483: {Ladder SAW filters} - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) ## Abstract Acoustic wave devices, and particularly piezoelectric layer arrangements in acoustic wave devices and related methods are disclosed. Acoustic wave devices may include a piezoelectric layer on a carrier substrate. The piezoelectric layer is formed with a thickness that is varied or shaped across different portions of the carrier substrate. Different piezoelectric layer thicknesses on a common carrier substrate may be provided for different surface acoustic wave (SAW) filter structures that are formed monolithically, for different sets of resonators within a single filter structure, and for different regions within a single SAW device in one or more of the transverse direction or the propagation directions. Shaping piezoelectric layers may include selectively removing or adding portions of the piezoelectric layer. In this manner, piezoelectric layer thicknesses at different hierarchy levels within SAW devices and filters may be tailored to provide different acoustic resonator properties without requiring separately formed devices on separate substrates. ## Claims ### Claim 1 A surface acoustic wave (SAW) device, comprising: a carrier substrate; a piezoelectric layer on the carrier substrate, wherein a first portion of the piezoelectric layer has a first thickness as measured in a direction perpendicular to the carrier substrate, a second portion of the piezoelectric layer has a second thickness as measured in the direction perpendicular to the carrier substrate, and wherein the first thickness is different than the second thickness; and at least one electrode on a surface of the piezoelectric layer opposite the carrier substrate. ### Claim 2 (depends on 1) The SAW device of claim 1, wherein the at least one electrode comprises a plurality of electrodes on the piezoelectric layer that define a first SAW filter structure and a second SAW filter structure on the carrier substrate, and the first SAW filter structure comprises the first portion of the piezoelectric layer and the second SAW filter structure comprises the second portion of the piezoelectric layer. ### Claim 3 (depends on 2) The SAW device of claim 2, wherein the first SAW filter structure and the second SAW filter structure each comprise a number of SAW resonators. ### Claim 4 (depends on 3) The SAW device of claim 3, wherein the first SAW filter structure and the second SAW filter structure further comprise a number of SAW coupled resonator filters. ### Claim 5 (depends on 1) The SAW device of claim 1, wherein the at least one electrode comprises a plurality of electrodes on the piezoelectric layer that define a SAW filter structure, and the SAW filter structure comprises a plurality of SAW resonators. ### Claim 6 (depends on 5) The SAW device of claim 5, wherein the plurality of SAW resonators form a number of series resonators that comprise the first portion of the piezoelectric layer and a number of shunt resonators that comprise the second portion of the piezoelectric layer. ### Claim 7 (depends on 1) The SAW device of claim 1, wherein the at least one electrode comprises an interdigitated transducer (IDT) and the SAW device further comprises first and second reflective structures that are arranged on the piezoelectric layer such that the IDT is positioned between the first reflective structure and the second reflective structure. ### Claim 8 (depends on 7) The SAW device of claim 7, wherein the IDT is arranged on the first portion of the piezoelectric layer and the first and second reflective structures are arranged on the second portion of the piezoelectric layer. ### Claim 9 (depends on 7) The SAW device of claim 7, wherein the first portion of the piezoelectric layer is registered with individual electrode fingers of the IDT and the second portion of the piezoelectric layer is registered between adjacent pairs of the individual electrode fingers. ### Claim 10 (depends on 7) The SAW device of claim 7, wherein the first portion of the piezoelectric layer and the second portion of the piezoelectric layer are arranged along a transverse direction of the SAW device such that an electrode finger of the IDT is arranged on both the first portion of the piezoelectric layer and the second portion of the piezoelectric layer. ### Claim 11 (depends on 10) The SAW device of claim 10, wherein a third portion of the piezoelectric layer comprises a third thickness as measured in the direction perpendicular to the carrier substrate, wherein the third thickness is different that the first thickness and the second thickness, and the electrode finger is arranged on the first, second, and third portions of the piezoelectric layer. ### Claim 12 A method comprising: providing a carrier substrate; providing a piezoelectric layer on the carrier substrate; shaping the piezoelectric layer such that a first portion of the piezoelectric layer is formed with a first thickness as measured in a direction perpendicular to the carrier substrate, a second portion of the piezoelectric layer is formed with a second thickness as measured in the direction perpendicular to the carrier substrate, and wherein the first thickness is different than the second thickness; and providing at least one electrode on a surface of the piezoelectric layer opposite the carrier substrate. ### Claim 13 (depends on 12) The method of claim 12, wherein shaping the piezoelectric layer comprises applying a selective removal process to form the second portion of the piezoelectric layer such that the second thickness is less than the first thickness. ### Claim 14 (depends on 13) The method of claim 13, wherein the selective removal process comprises forming a patterned etch mask over the first portion of the piezoelectric layer and selectively etching the second portion of piezoelectric layer. ### Claim 15 (depends on 13) The method of claim 13, wherein the at least one electrode is formed on the second portion of the piezoelectric layer. ### Claim 16 (depends on 12) The method of claim 12, wherein the at least one electrode comprises a plurality of electrodes on the piezoelectric layer that define a first surface acoustic wave (SAW) filter structure and a second SAW filter structure on the carrier substrate, and the first SAW filter structure comprises the first portion of the piezoelectric layer and the second SAW filter structure comprises the second portion of the piezoelectric layer. ### Claim 17 (depends on 16) The method of claim 16, wherein the first SAW filter structure and the second SAW filter structure each comprise a number of SAW resonators. ### Claim 18 (depends on 12) The method of claim 12, wherein the at least one electrode comprises a plurality of electrodes on the piezoelectric layer that define a surface acoustic wave (SAW) filter structure, and the SAW filter structure comprises a plurality of SAW resonators. ### Claim 19 (depends on 18) The method of claim 18, wherein the plurality of SAW resonators form a number of series resonators that comprise the first portion of the piezoelectric layer and a number of shunt resonators that comprise the second portion of the piezoelectric layer. ### Claim 20 (depends on 12) The method of claim 12, wherein the at least one electrode comprises an interdigitated transducer (IDT) and the method further comprises providing first and second reflective structures that are arranged on the piezoelectric layer such that the IDT is positioned between the first reflective structure and the second reflective structure. ### Claim 21 (depends on 20) The method of claim 20, wherein the IDT is arranged on the first portion of the piezoelectric layer and the first and second reflective structures are arranged on the second portion of the piezoelectric layer. ### Claim 22 (depends on 20) The method of claim 20, wherein the first portion of the piezoelectric layer and the second portion of the piezoelectric layer are arranged along a transverse direction of the piezoelectric layer such that an electrode finger of the IDT is arranged on both the first portion of the piezoelectric layer and the second portion of the piezoelectric layer.