# US 2023/0411570 A1 · Electronic device and method for manufacturing the same

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- Number: US 2023/0411570 A1
- Document ID: US20230411570A1
- Status: Published application
- Kind: A1
- Application number: 18/317,567
- Filed: 2023-05-15
- Published: 2023-12-21
- Earliest claimed: 2022-06-15
- Assignees: Innolux Corporation
- Applicants: InnoLux Corporation
- Inventors: Zhi-Wei ZHANG; Hua-Pin CHEN; Shuai WANG; Chien-Hao KUO
- Web page: https://patentgrep.com/patent/US20230411570A1

## CPC

- H10H 20/852: Encapsulations
- H10H 20/855: Optical field-shaping means, e.g. lenses
- H10H 20/856: Reflecting means
- H10K 50/844: Encapsulations
- H10K 50/856: comprising reflective means
- H10H 20/0362: {of encapsulations}
- H10H 20/0363: {of optical field-shaping means}
- H10K 59/873: {Encapsulations}
- H10K 59/878: {comprising reflective means}
- H10W 90/00: Package configurations
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic device and a method for manufacturing the same are provided. The electronic device includes: a substrate; an electronic component disposed on the substrate; a first optical component disposed on the substrate and the electronic component; and a first optical adhesive disposed between the substrate and the first optical component to bond the substrate and the first optical component, wherein a Young's modulus of the first optical adhesive ranges between 10 kPa and 150 kPa.

## Claims

### Claim 1

An electronic device, comprising:
a substrate;
an electronic component disposed on the substrate;
a first optical component disposed on the substrate and the electronic component; and
a first optical adhesive disposed between the substrate and the first optical component to bond the substrate and the first optical component,
wherein a Young's modulus of the first optical adhesive ranges between 10 kPa and 150 kPa.

### Claim 2 (depends on 1)

The electronic device of claim 1, further comprising: a reflective structure disposed on the substrate and adjacent to the electronic component, wherein there is a gap between the reflective structure and the electronic component, and the gap ranges between 0.05 mm and 0.25 mm.

### Claim 3 (depends on 2)

The electronic device of claim 2, wherein the reflective structure comprises a white reflective layer, a metal reflective layer, an enhanced specular reflector or a combination thereof.

### Claim 4 (depends on 2)

The electronic device of claim 2, wherein the reflective structure has an opening, and the electronic component is disposed correspondingly to the opening.

### Claim 5 (depends on 1)

The electronic device of claim 1, wherein the substrate has a first surface, the electronic component has a second surface away from the first surface, and the first optical component has a third surface adjacent to the first surface; wherein there is a first distance between the second surface of the electronic component and the first surface of the substrate, there is a second distance between the third surface of the first optical component and the first surface of the substrate, and the first distance and the second distance satisfy the following equation:
T1×1.5<T2≤3 mm
wherein T1 is the first distance and T2 is the second distance.

### Claim 6 (depends on 1)

The electronic device of claim 1, further comprising: a reflective structure disposed on the substrate, wherein the substrate and the reflective structure have a through hole penetrating the substrate and the reflective structure, and the electronic component is disposed correspondingly to the through hole.

### Claim 7 (depends on 6)

The electronic device of claim 6, wherein the electronic component overlaps the through hole in a normal direction of the substrate.

### Claim 8 (depends on 6)

The electronic device of claim 6, wherein a conductive material is disposed in the through hole.

### Claim 9 (depends on 1)

The electronic device of claim 1, further comprising: a second optical component and a second optical adhesive, wherein the second optical component and the second optical adhesive are respectively disposed on the first optical component, and the second optical adhesive is disposed between the first optical component and the second optical component.

### Claim 10

A method for manufacturing an electronic device, comprising the following steps:
providing a substrate;
disposing an electronic component on the substrate; and
adhering a first optical adhesive on the substrate and the electronic component and performing a vacuuming step, wherein a temperature of the vacuuming step ranges between 10° C. and 70° C.

### Claim 11 (depends on 10)

The method of claim 10, further comprising a step of: disposing a reflective structure on the substrate and adjacent to the electronic component before the step of adhering the first optical adhesive on the substrate and the electronic component.

### Claim 12 (depends on 10)

The method of claim 10, further comprising a step of: adhering the first optical adhesive to an optical component before the step of adhering the first optical adhesive on the substrate and the electronic component.

### Claim 13

An electronic device, comprising:
a substrate;
an electronic component disposed on the substrate;
a reflective structure disposed on the substrate and adjacent to the electronic component;
a first optical component disposed on the substrate and the electronic component; and
a first optical adhesive disposed between the substrate and the first optical component to bond the substrate and the first optical component,
wherein there is a gap between the reflective structure and the electronic component, and the gap ranges between 0.05 mm and 0.25 mm.

### Claim 14 (depends on 13)

The electronic device of claim 13, wherein the reflective structure comprises a white reflective layer, a metal reflective layer, an enhanced specular reflector or a combination thereof.

### Claim 15 (depends on 13)

The electronic device of claim 13, wherein the reflective structure has an opening, and the electronic component is disposed correspondingly to the opening.

### Claim 16 (depends on 13)

The electronic device of claim 13, wherein the substrate has a first surface, the electronic component has a second surface away from the first surface, and the first optical component has a third surface adjacent to the first surface; wherein there is a first distance between the second surface of the electronic component and the first surface of the substrate, there is a second distance between the third surface of the first optical component and the first surface of the substrate, and the first distance and the second distance satisfy the following equation:
T1×1.5<T2≤3 mm
wherein T1 is the first distance and T2 is the second distance.

### Claim 17 (depends on 13)

The electronic device of claim 13, wherein the substrate and the reflective structure have a through hole penetrating the substrate and the reflective structure, and the electronic component is disposed correspondingly to the through hole.

### Claim 18 (depends on 17)

The electronic device of claim 17, wherein the electronic component overlaps the through hole in a normal direction of the substrate.

### Claim 19 (depends on 17)

The electronic device of claim 17, wherein a conductive material is disposed in the through hole.

### Claim 20 (depends on 13)

The electronic device of claim 13, further comprising: a second optical component and a second optical adhesive, wherein the second optical component and the second optical adhesive are respectively disposed on the first optical component, and the second optical adhesive is disposed between the first optical component and the second optical component.