# US 2023/0411569 A1 · Method for manufacturing light-emitting device, and light-emitting device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2023/0411569 A1 - Document ID: US20230411569A1 - Status: Published application - Kind: A1 - Application number: 18/334,773 - Filed: 2023-06-14 - Published: 2023-12-21 - Earliest claimed: 2022-06-15 - Assignees: Nichia Corporation - Applicants: Nichia Corporation - Inventors: Hiroaki KAGEYAMA - Web page: https://patentgrep.com/patent/US20230411569A1 ## CPC - H10H 20/8506: {Containers} - H10H 20/8514: {characterised by their shape, e.g. plate or foil} - H10H 20/01: Manufacture or treatment - H10H 20/851: Wavelength conversion means - H10H 20/852: Encapsulations - H10H 20/854: characterised by their material, e.g. epoxy or silicone resins - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10H 20/036: {of packages} - H10H 20/0361: {of wavelength conversion means} - H10H 20/0362: {of encapsulations} - H10H 20/0364: {of interconnections} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS ## Abstract A method for manufacturing a light-emitting device includes: providing a substrate on which a semiconductor portion is disposed; providing a support substrate having conductivity, including a first surface and a second surface on a side opposite to the first surface, and including a groove portion formed at the first surface; electrically connecting the semiconductor portion and the support substrate by disposing the semiconductor portion on the first surface across the groove portion in a plan view; removing the substrate from the semiconductor portion; bonding a wavelength conversion member to the semiconductor portion from which the substrate has been removed; supplying a resin member having light reflectivity into the groove portion and a space between the support substrate and the wavelength conversion member; and exposing the resin member in the groove portion from the support substrate by removing part of the support substrate from the second surface side. ## Claims ### Claim 1 A method for manufacturing a light-emitting device, comprising: providing a substrate on which a semiconductor portion is disposed; providing a support substrate having conductivity, including a first surface and a second surface on a side opposite to the first surface, and including a groove portion formed at the first surface; electrically connecting the semiconductor portion and the support substrate by disposing the semiconductor portion on the first surface across the groove portion in a plan view; removing the substrate from the semiconductor portion; bonding a wavelength conversion member to the semiconductor portion from which the substrate has been removed; supplying a resin member having light reflectivity into the groove portion and a space between the support substrate and the wavelength conversion member; and exposing the resin member in the groove portion from the support substrate by removing part of the support substrate from the second surface side. ### Claim 2 (depends on 1) The method for manufacturing a light-emitting device, according to claim 1, wherein the light-emitting device includes a plurality of the semiconductor portions disposed on the substrate, and the method further includes, after the exposing the resin member from the support substrate, removing the wavelength conversion member, the resin member, and the support substrate that are located between the semiconductor portions in the plan view, and dividing into a plurality of light-emitting devices. ### Claim 3 (depends on 1) The method for manufacturing a light-emitting device, according to claim 1, wherein the light-emitting device includes a plurality of the semiconductor portions disposed on the substrate, the light-emitting device further comprises: a first electrode portion and a second electrode portion spaced apart from the first electrode portion provided for at least one of the semiconductor portions, and a Zener diode electrically connected to the first electrode portion and the second electrode portion of the corresponding semiconductor portion, wherein in the electrically connecting the semiconductor portion and the support substrate, the Zener diode is disposed in the groove portion. ### Claim 4 (depends on 3) The method for manufacturing a light-emitting device, according to claim 3, wherein, the light-emitting device includes a plurality of the Zener diodes, in the providing the support substrate, a plurality of the groove portions are formed along a first direction on the support substrate, and in the electrically connecting the semiconductor portion and the support substrate, the semiconductor portions and the support substrate are connected to each other such that the Zener diodes provided for one or more of the semiconductor portions are respectively disposed in a corresponding one of the groove portions. ### Claim 5 (depends on 1) The method for manufacturing a light-emitting device, according to claim 1, wherein the groove portion and the space between the support substrate and the wavelength conversion member are connected with each other, and in the supplying the resin member, the resin member in the groove portion and the space between the support substrate and the wavelength conversion member is supplied through the groove portion. ### Claim 6 (depends on 2) The method for manufacturing a light-emitting device, according to claim 2, wherein in the dividing into the plurality of light-emitting devices, the dividing is performed such that a size of an outer boundary of each of the resin member and the support substrate is equal to or smaller than a size of an outer boundary of the wavelength conversion member in the plan view. ### Claim 7 (depends on 1) The method for manufacturing a light-emitting device, according to claim 1, wherein in the providing the support substrate, the support substrate provided with a first conductive member on the first surface and an inner surface of the groove portion is provided. ### Claim 8 (depends on 7) The method for manufacturing a light-emitting device, according to claim 7, further comprising: after the exposing the resin member, forming a second conductive member on a third surface of the support substrate such that the second conductive member is electrically connected to the first conductive member, the third surface formed on a side opposite to the first surface by removing the part of the support substrate. ### Claim 9 (depends on 1) The method for manufacturing a light-emitting device, according to claim 1, wherein in the supplying the resin member, the resin member thinner than a thickness of the wavelength conversion member is formed between the support substrate and the wavelength conversion member. ### Claim 10 A light-emitting device comprising: a semiconductor portion including a first surface and a second surface on a side opposite to the first surface; a first electrode portion disposed on the first surface; a second electrode portion spaced apart from the first electrode portion on the first surface; a first support substrate having conductivity and being connected to the first electrode portion such that the first support substrate is partially overlapped with the first electrode portion in a plan view; a second support substrate having conductivity and being connected to the second electrode portion such that the second support substrate is partially overlapped with the second electrode portion in the plan view; a wavelength conversion member disposed on the second surface; and a resin member having light reflectivity disposed between the wavelength conversion member and the first support substrate, between the wavelength conversion member and the second support substrate, and between the first support substrate and the second support substrate. ### Claim 11 (depends on 10) The light-emitting device according to claim 10, wherein a thickness of the wavelength conversion member is larger than a thickness of the resin member disposed between the wavelength conversion member and the first support substrate. ### Claim 12 (depends on 10) The light-emitting device according to claim 10, wherein a thickness of each of the first support substrate and the second support substrate is larger than a thickness of the resin member disposed between the wavelength conversion member and the first support substrate. ### Claim 13 (depends on 10) The light-emitting device according to claim 10, further comprising: a Zener diode electrically connected to the first electrode portion and the second electrode portion on a side opposite to the semiconductor portion side, wherein the Zener diode is disposed in the resin member between the first support substrate and the second support substrate. ### Claim 14 (depends on 10) The light-emitting device according to claim 10, wherein the resin member, the first support substrate, and the second support substrate are disposed inside an outer boundary of the wavelength conversion member in the plan view.