# US 2023/0411084 A1 · Solid electrolytic capacitor

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- Number: US 2023/0411084 A1
- Document ID: US20230411084A1
- Status: Published application
- Kind: A1
- Application number: 18/252,053
- Filed: 2021-11-25
- Published: 2023-12-21
- Earliest claimed: 2020-11-30
- Assignees: Panasonic Intellectual Property Management Co., Ltd.
- Applicants: Panasonic Intellectual Property Management Co., Ltd.
- Inventors: KATSUHIRO OGASAWARA; ATSUSHI TANAKA
- Web page: https://patentgrep.com/patent/US20230411084A1

## CPC

- H01G 9/012: specially adapted for solid capacitors
- H01G 9/10: Sealing, e.g. of lead-in wires
- H01G 9/15: Solid electrolytic capacitors (H01G11/00 takes precedence)
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)

## Abstract

A solid electrolytic capacitor includes at least one capacitor element including an anode part and a cathode part, an anode lead terminal, a cathode lead terminal, and an exterior body that covers the least one capacitor element. Each of the anode lead terminal and the cathode lead terminal includes an embedded part embedded in the exterior body. The embedded part of the anode lead terminal has a first contact surface in contact with the exterior body, and the embedded part of the cathode lead terminal has a second contact surface in contact with the exterior body. At least one contact surface selected from the group consisting of the first contact surface and the second contact surface includes a rough surface having a developed area ratio of an interface of more than or equal to 0.4.

## Claims

### Claim 1

A solid electrolytic capacitor comprising:
at least one capacitor element that includes an anode part and a cathode part;
an anode lead terminal electrically connected to the anode part; and
a cathode lead terminal electrically connected to the cathode part; and
an exterior body that covers the at least one capacitor element,
wherein:
each of the anode lead terminal and the cathode lead terminal includes an embedded part and an exposed part, the embedded part being embedded in the exterior body, the exposed part being connected to the embedded part and being exposed from the exterior body,
the embedded part of the anode lead terminal includes a first contact surface in contact with the exterior body,
the embedded part of the cathode lead terminal includes a second contact surface in contact with the exterior body, and
at least one contact surface selected from the group consisting of the first contact surface and the second contact surface includes a rough surface having a developed area ratio of an interface of more than or equal to 0.4.

### Claim 2 (depends on 1)

The solid electrolytic capacitor according to claim 1, wherein the rough surface extends from the embedded part to the exposed part to be disposed on at least a part of the exposed part.

### Claim 3 (depends on 1)

The solid electrolytic capacitor according to claim 1, wherein each of the first contact surface and the second contact surface includes the rough surface.

### Claim 4 (depends on 1)

The solid electrolytic capacitor according to claim 1, wherein the rough surface has the developed area ratio of the interface of less than or equal to 10.0.

### Claim 5 (depends on 1)

The solid electrolytic capacitor according to claim 1, wherein:
at least one base material selected from the group consisting of a base material of the anode lead terminal and a base material of the cathode lead terminal is a copper base material, and
at least a part of the copper base material in the exposed part is covered with a copper plating layer.

### Claim 6 (depends on 5)

The solid electrolytic capacitor according to claim 5, wherein:
the copper base material includes a bent part bent along an outer surface of the exterior body in the exposed part, and
a surface on an outside of the bent part is covered with the copper plating layer.

### Claim 7 (depends on 5)

The solid electrolytic capacitor according to claim 5, further comprising a tin plating layer that covers the copper plating layer.

### Claim 8 (depends on 7)

The solid electrolytic capacitor according to claim 7, further comprising another layer disposed between the copper plating layer and the tin plating layer, wherein the another layer is a nickel plating layer or an alloy layer of copper and tin.

### Claim 9 (depends on 5)

The solid electrolytic capacitor according to claim 5, further comprising a noble metal plating layer that covers the copper plating layer, wherein the noble metal plating layer includes at least one selected from the group consisting of gold, platinum, and palladium.

### Claim 10 (depends on 9)

The solid electrolytic capacitor according to claim 9, further comprising a nickel plating layer disposed between the copper plating layer and the noble metal plating layer.