Method for producing a multi-layered card body
AssigneeGiesecke+Devrient Mobile Security GmbH
InventorMichael BALDISCHWEILER
Life of this patent
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Abstract
In a method for manufacturing a multi-layered card body with a metallic core layer and at least one cover layer for a contactless or dual-interface chip card an adhesive is applied to at least one side of the metallic core layer in such a manner that a slot in the metallic core layer is filled with the adhesive. The metallic core layer is subsequently laminated with the cover layer by means of the adhesive. As a result, no short-circuit can occur in the slot, e.g. by metal chips remaining in the slot, because the slot has already been filled with the adhesive.
Claims11
-10. (canceled)
A method for manufacturing a multi-layered card body with a metallic core layer for a contactless or a dual-interface chip card, comprising the steps of:
- making available a metallic core layer with at least one slot and making available at least one cover layer;
- applying an adhesive to at least one side of the metallic core layer in such a manner that the at least one slot is filled with the adhesive;
- and
- laminating the at least one cover layer with the metallic core layer by means of the adhesive.
A multi-layered card body with at least one cover layer and a metallic core layer with at least one slot for a contactless or dual-interface chip card,
- wherein the metallic core layer is connected to the at least one cover layer by means of an adhesive,
- wherein the at least one slot is filled with the adhesive.
Dependencies are inferred from the claim text.