US 2023/0408931 A1 · METHOD OF DETERMINING MARK STRUCTURE FOR OVERLAY FINGERPRINTS

Abstract

An apparatus and a method for generating a metrology mark structure that can be formed on a substrate for measuring overlay characteristics induced by one or more processes performed on the substrate by determining features for the metrology mark structure based on a pattern distribution. The method involves obtaining a function to characterize an overlay fingerprint induced by a process performed on a substrate. Based on the function, a pattern distribution is derived, the pattern distribution being indicative of a number of features (e.g., indicative of density) within a portion of the substrate. Based on the pattern distribution, a physical characteristic (e.g., shape, size, etc.) of the features of the metrology mark structure is determined.

Claims20

Dependent claims

A non-transitory computer-readable medium, the medium comprising instructions stored therein that, when executed by one or more processors, cause the one or more processors to at least:

obtain a first function to characterize an overlay fingerprint induced by a semiconductor manufacturing process performed on a substrate;
derive, based on the first function, a pattern distribution indicative of a number of features within a portion of the substrate;
and
determine, based on the pattern distribution, one or more physical characteristics of features of the metrology mark structure for disposing on the substrate.

1 more element

A non-transitory computer-readable medium comprising instructions therein, the instructions, when executed by one or more processors, are configured to cause the one or more processors to at least:

obtain a first function that characterizes an overlay fingerprint induced by semiconductor manufacturing processes performed on a substrate, the overlay fingerprint being a representation of an overlay between features on a first layer of the substrate and features on a second layer of the substrate;
obtain a second function that characterizes a physical effect of a process of the semiconductor manufacturing processes on the substrate;
determine, by application of a deconvolving operation between the first function and the second function, a pattern distribution for the first layer, the pattern distribution indicative of a density of features within a portion of the first layer;
and
generate, based on the pattern distribution, a shape and/or positioning of one or more features of a metrology mark structure for measuring overlay characteristics induced by the semiconductor manufacturing processes.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application

18/035,286Filed 1 Nov 2021

Priority

24 Nov 2020

Published

21 Dec 2023

Term ends

Not estimatedThe source records don’t support an estimate.

Classification8 codes

G03F 7/706837
Metrology information management or control: data analysis, e.g. filtering, weighting, flyer removal, fingerprints or root cause analysis
G03F 7/705
Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring…:…
G03F 7/70625
Monitoring the printed patterns: dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
G03F 7/70633
Monitoring the printed patterns: overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the…

Method of determining mark structure for overlay fingerprints

Life of this patent

Method of determining mark structure for overlay fingerprints

Life of this patent

Abstract

Claims20