High-Temperature-Compatible Fiber Array Packaging Methods

A method for attaching an optical fiber to a photonic integrated circuit chip, comprising:

• having a photonic integrated circuit chip that includes an optical fiber attachment area;
• disposing at least one optical fiber within the optical fiber attachment area;
• disposing a lid structure over the at least one optical fiber;
• and
• forming soldered connections between the lid structure and the photonic integrated circuit chip such that upon cooling of the soldered connections the lid structure is drawn toward the photonic integrated circuit chip causing the lid structure to press against the at least one optical fiber to mechanically hold the at least one optical fiber against the optical fiber attachment area.

A method for manufacturing a package assembly, comprising:

• having a photonic integrated circuit chip that includes an optical fiber attachment area;
• disposing at least one optical fiber within the optical fiber attachment area;
• disposing a lid structure over the at least one optical fiber;
• performing a first solder reflow process to form a first set of soldered connections between the lid structure and the photonic integrated circuit chip such that upon cooling of the first set of soldered connections the lid structure presses against the at least one optical fiber to mechanically hold the at least one optical fiber against the optical fiber attachment area;
• and
• after forming the first set of soldered connections, performing a second solder reflow process to form a second set of soldered connections between the photonic integrated circuit chip and a package component.