Imaging ellipsometer and method of measuring an overlay error using the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJaehyeon Son, Jinwoo Ahn, Juntaek Oh, Hankyoul Moon, Myungjun Lee, Eunsoo Hwang
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AssigneeSamsung Electronics Co., Ltd.
InventorsJaehyeon Son, Jinwoo Ahn, Juntaek Oh, Hankyoul Moon, Myungjun Lee, Eunsoo Hwang
Estimating the term…
In a method of measuring an alignment error, light is incident on a surface of a reference wafer having a known polarization transmittance at the surface. An image signal is obtained from the reference wafer at a set of angles including a first combination of values of a polarizer angle and an analyzer angle. Polarization transmittance of optical equipment including a polarizer and an analyzer is calculated from the image signal of the reference wafer. Light is incident on a surface of a measurement target wafer having a structure on the surface thereof. An image signal is obtained from the measurement wafer at a set of angles including a second combination of values of the polarizer angle and the analyzer angle. At least a portion of Mueller matrix is generated from the image signal of the measurement wafer.
A method of measuring an alignment error, the method comprising:
A method of measuring an alignment error, the method comprising:
21-25. (canceled)
Dependencies are inferred from the claim text.